The TS9200D Series Jet Tech is a non-contact dispense valve capable of jetting fluid viscosities to 400,000 Cps. Jet Tech offers a fast jetting action producing hundreds of precise droplets in less than one second.
The main feature of the valve is a single, easily replaceable diaphragm to eliminate dynamic fluid seals found in other jet valves. No longer is it necessary to disassemble, clean and replace worn seals, which translates into saving time and money. The diaphragm also allows fast cycle rates because of its very small mass. There is no large sliding valve stem that slows down the process. With this novel diaphragm design, the energy needed to eject a drop can be adjusted providing a wider process window.
The TS9200D Series Jet Tech is available in the following configurations:
TS9200D-125E Jet Valve EPDM Diaphragm, 125�m Nozzle
TS9200D-150E Jet Valve EPDM Diaphragm, 150�m Nozzle
TS9200D-200E Jet Valve EPDM Diaphragm, 200�m Nozzle
TS9200D-125S Jet Valve Silicone Diaphragm, 125�m Nozzle
TS9200D-150S Jet Valve Silicone Diaphragm, 150�m Nozzle
TS9200D-200S Jet Valve Silicone Diaphragm, 200�m Nozzle
Features
No fluid seals to clean or replace
Up to 300 drops/ sec
Outstanding repeatabilty
Viscosities up to 400K cps
Drops as small as 10nl
Integral heater with minimal fluid heated
Tungsten carbide internal components for long life
Quick and simple maintenance
Specifications
Size Width: 50.8mm (2.00")
Size Depth: 93.8mm (3.69")
Size Height: 88.9mm (3.50")
Weight: 348g (0.77lb)
Speed: Up to 300Hz Continuous Duty
Syringe Capacity: 5, 10, 30 and 55cc
Minimum Shot Size: 10nl
Viscosity Range: 1 to 400K Cps.
Fluid Pressure: 40 psi(2.76 bar)
Nozzle Sizes: 100�m, 125�m, 150�m, 200�m
Jet Pressure: 35psi to 70psi (2.41 to 4.8 bar)
Controller Interface: RS-232 & LCD Display w/ Interface
Input/ Output: TTL Level Triggers
Operating Temperature: 10 to 50 C
The TS900D Jet Tech can be used in wide range of applications. Some examples of processes and applications are:
Jetting silver epoxies for die bonding processes
Jetting silicone phosphor in the LED assembly process
Jetting under-fill in micro-electronic package applications on PCBA
Jetting micro dots of UV adhesive in medical device applications
