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Epoxy Encapsulant, Flame Retardant, Packet, Black, 250 gram
The ADPC184 is a 250gm Epoxy Resin general purpose flame retardant potting and encapsulating compound has a long usable life and may be hot or cold cured. The system exhibits good surface finish, high electrical strength, good thermal conductivity, low exothermic and low cure shrinkage. The semi-flexible nature allows thermal expansion without cured stress and this makes compatible with most circuit board components and materials over a wide temperature range adhesion is excellent to most plastics and substrates. The combination of properties and the ease of use of the material will lend itself to a wide range of applications does not contain halogens or heavy metals. High electrical insulating characteristics.
- Non-toxic
- Good thermal conductivity
- Low shrinkage
- High adhesion
- UL94V-0 Flammability rating at 3mm
- Good chemical and water resistance
- 0.85W/mK Thermal conductivity
- -55 to 130�C Operating temperature range
- 18kV/mm Dielectric strength
Consumer Electronics; Industrial; Maintenance & Repair.
Adhesive Dispensing Ltd provide a wide range of equipment options for dispensing almost all assembly fluids - from watery liquids, solvents, primers and activators through to thick pastes, sealants, silicones, gels and epoxies.
Application of adhesive
Use manual or pneumatic application equipment. Mix in hinge-pack as instructed, snip the corner. Pour mixed material into syringe barrel. Use with non-timed syringe gun applicator or with air-powered dispenser.
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Features
- Non-toxic
Good thermal conductivity
Low shrinkage
High adhesion
UL94V-0 Flammability rating at 3mm
Good chemical and water resistance
0.85W/mK Thermal conductivity
-55 to 130�C Operating temperature range
18kV/mm Dielectric strength
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